Home > Article > Technology peripherals > It is reported that Nvidia once asked TSMC about the possibility of building an off-site CoWoS advanced packaging line, but was rejected
According to news from this site on July 23, Taiwanese media "Mirror Weekly" reported today that Nvidia CEO Jen-Hsun Huang visited partner TSMC when he led a delegation to Taiwan to attend the 2024 Taipei International Computer Show in June this year, seeking to strengthen CoWoS production capacity cooperation. AI computing GPUs based on NVIDIA Hopper, Blackwell and other architectures require 2.5D packaging to integrate with HBM memory. At present, TSMC is still Nvidia’s only 2.5D packaging mass production supplier with its mature CoWoS process.
1. Nvidia hopes that TSMC will set up an exclusive CoWoS advanced packaging production line for Nvidia outside the factory.Taiwanese media quoted anonymous people in the technology circle as saying that it was not unreasonable for TSMC to reject Nvidia’s proposal:
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