In sync with Samsung and Micron, SK Hynix will launch new 1bnm 32Gb DDR5 memory this year

According to Korean media NEWSIS, a first-quarter 2024 financial report conference call was held today. SK Hynix revealed a major plan: they expect to launch new 1bnm 32Gb DDR5 memory particles within the year. This innovative memory particle will bring new vitality to the memory market.

According to data, this 32GB memory particle will provide consumer-level UDIMM and SODIMM with a single capacity of up to 64GB, providing stronger support for enterprise-level applications. Especially for enterprise-level RDIMM, it can achieve a capacity of 128GB in a single module without resorting to stable through-hole process 3D stacking technology, which will undoubtedly greatly meet the growing demand for large memory in servers.

SK Hynix’s breakthrough in memory technology did not happen overnight. The company announced in May 2023 that it had completed the development of 1bnm memory, which introduced advanced HKMG technology. This technology can significantly reduce leakage, improve capacitor performance, and thereby reduce power consumption, providing new possibilities for efficient and environmentally friendly memory products.

At the same time, competition in the global memory market is becoming increasingly fierce. Samsung Electronics and Micron have also announced their own 32GB DDR5 memory chips. It is understood that Samsung Electronics’ 32GB DDR5 DRAM has started mass production at the end of last year as planned, and Micron also plans to launch its corresponding products this year.

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