New title: Revealing Samsung LPCAMM memory specifications: incompatible with traditional CAMM, unique internal design unveiled

News on September 27, Samsung Electronics announced yesterday that it has successfully developed a new 7.5Gbps low-power compressed add-on memory module (LPCAMM). This innovative specification marks a major breakthrough in future memory technology. The module combines the features of compact size and detachability and is expected to be commercialized in 2024.

It is reported that LPCAMM memory is a technological innovation improved by Samsung on the basis of LPDDR memory. Despite the similarity in name to CAMM, they are actually physically and electrically incompatible. The unique design of this memory module is that it directly packages four 32-bit LPDDR5X memory particles on a compression connector, enabling the use of a 128-bit memory bus. It can be seen from a pad diagram that the contacts of LPCAMM memory are located on the back of the PCB board, very close to the memory particles, thus greatly shortening the signal transmission distance.

The size of LPCAMM memory is 78mm x 23mm, in addition to the DRAM package itself, it also includes SPD and power management IC (PMIC). Similar to the CAMM standard, it allows the module to provide its own voltage regulation and identification functions. Initially, Samsung plans to launch 32GB, 64GB and 128GB versions of LPCAMM memory, supporting the data rate of LPDDR5X-7500. However, considering that there is currently no 256Gbit LPDDR5X memory chips, to achieve a single 128GB memory, you need to either install 8 chips on LPCAMM or increase the overall size of the memory module.

According to the editor’s understanding, Samsung has successfully completed system verification on the Intel platform and plans to conduct LPCAMM testing with major customers, including Intel, in 2023. In addition, they are working with partners to develop the JEDEC standard for LPCAMM to promote the standardization of this technology. At the same time, JEDEC is also actively expanding the CAMM standard to cover LPDDR memory and implement the same connector standards as DDR5 and LPDDR5, paving the way for future memory technology development. This series of innovations is expected to improve the memory performance and efficiency of mobile devices and computers, bringing new possibilities for future technological development.

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