Sources say that due to supply chain capacity upgrades, AI chips produced by TSMC will become “more expensive” in the future

According to Taiwan's "United Daily News", TSMC's supply chain has expanded its CoWoS advanced packaging capacity, which has led to an increase in the price of interlayer films and ultimately increased the company's cost of producing AI chips

TSMC is investing Billions of dollars to upgrade its packaging capabilities due to strong demand for artificial intelligence products. The company announced in July this year that it would invest US$2.89 billion (approximately RMB 21.126 billion) to build a new chip packaging plant. TSMC aims to increase packaging production capacity to 30,000 pieces per month by the end of 2024

Note from this site: CoWoS technology is a technology that stacks multiple chip dies together. By placing these chip dies On the silicon interlayer, their performance can be improved

It is reported that TSMC is purchasing CoWoS machines from equipment factories such as Xinyun, Wanrun, Hongsu, Tisheng, and Qunyi. These companies are expected to become TSMC CoWoS The biggest beneficiary of the increase in product demand is expected to complete delivery and installation in the first half of next year.

Industry sources revealed that TSMC’s current CoWoS advanced packaging monthly production capacity is about 12,000 pieces. After the previous expansion, the original monthly production capacity will gradually expand to 15,000 to 20,000 pieces, and after that, additional equipment will be stationed in the factory. In the future, will enable TSMC's monthly production capacity to reach more than 25,000 pieces, or even move closer to 30,000 pieces, thereby increasing TSMC's ability to undertake AI-related orders. Due to related production capacity upgrades, TSMC's AI chips The film will also see a price increase.

In addition, Taiwanese media pointed out that Nvidia is currently TSMC’s largest customer of CoWoS advanced packaging, with orders accounting for 60% of production capacity. Recently, due to the increased demand for artificial intelligence computing, Nvidia has expanded its order volume, and customers such as Amazon and Broadcom have also begun to place urgent orders

In view of customers' urgent demand for CoWoS advanced packaging production capacity, TSMC has recently once again requested equipment manufacturers An additional 30% of the order is required, and delivery and installation are required to be completed before the end of the second quarter of next year so that mass production can begin in the second half of next year

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