ASE: FOPLP fan-out panel-level packaging is expected to begin small-scale shipments in the second quarter of 2025

News from this site on July 26. According to Taiwanese media "Business Times" reported today, ASE Chief Operating Officer (Chief Operating Officer, COO) Wu Tianyu said at the legal person briefing on the 25th that the company's FOPLP production capacity will be in the second quarter of 2025. Start small-scale shipments. FOPLP, the full name of Fan-Out Panel-Level Packaging, is fan-out panel-level packaging. It is one of the key technologies currently booming in the field of advanced packaging. FOPLP transfers packaging substrates from circular wafers of up to 12 inches to larger rectangular panels. On the one hand, this can reduce the corner loss caused by the circular substrate; on the other hand, it can realize larger-scale packaging operations at one time and improve production efficiency.

▲ ASE VIPack Advanced Packaging Platform Logo Wu Tianyu said that ASE has been conducting research and development work in the field of FOPLP solutions for more than five years. It has previously intensively negotiated and cooperated with customers, partners, and equipment suppliers, and has now implemented FOPLP The size of the rectangular panels used extends from 300×300 (mm) to 600×600 (mm).
According to a report from research firm TrendForce earlier this month, ASE’s first FOPLP orders are expected to come from Qualcomm’s PMIC and RF products and AMD’s PC CPU products.
Reports indicate that Taiwanese OSAT (this site’s note: outsourced semiconductor packaging and testing) companies, represented by ASE and Li, have many years of research and development history in FOPLP and have more technical advantages. FOPLP advanced packaging services have the opportunity to become the mainstay of these companies in the future. Important product lines.

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