Ming-Chi Kuo broke the news: Apple iPhone 17 will not use new motherboard materials

July 18 news: Recently, well-known Apple analyst Ming-Chi Kuo revealed that Apple has decided to once again delay its plan to use new resin-coated copper foil (RCC) components in iPhones. This innovative material was originally expected to debut on iPhone
16, but its debut was postponed to iPhone 17. Now it seems that iPhone 17 will also miss this technology. RCC technology has attracted much attention because it can significantly reduce the thickness of the motherboard and further save the internal space of the device. According to Ming-Chi Kuo's analysis last October, RCC materials do not contain glass fiber, which makes the drilling process more convenient and is expected to profoundly change the internal structure of the iPhone. Nonetheless, Apple and its supply chain partners have encountered durability and fragility challenges in practical applications of RCC.

1. It is these quality issues that prevent RCC components from meeting Apple’s stringent product quality requirements.

2. So in the upcoming 2025 iPhone 17, we will not see RCC appearing as PCB motherboard material.
3. If Apple can successfully introduce RCC technology into the iPhone, it may bring greater flexibility to the internal design of the device.
4. As for whether Apple will use RCC technology in the iPhone 18 in 2026, it is still unknown. -->

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