ASML CFO Dassen responded to doubts: High-NA EUV lithography is still the most economical choice in the future, and related orders are steadily increasing

According to news from this site on February 2, ASML Chief Financial Officer Roger Dassen recently accepted an interview with local Dutch media Bits&Chips. In the interview, Dassen responded to the doubts of the analyst organization SemiAnalysis, saying that High-NA (high numerical aperture) EUV (extreme ultraviolet light) lithography machines are still the most economical choice in the future.

SemiAnalysis previously published an article that believes that High-NA lithography technology will use higher exposure doses, thereby significantly reducing the number of wafers per unit time. Circle throughput. This means that compared to using the existing 0.33NA EUV lithography machine with multiple exposures, the introduction of High-NA will not bring cost advantages in the near future.

Dassen believes that SemiAnalysis's view underestimates the complexity of the multiple exposure route. One of the key reasons for the difficulty of Intel's 10nm process is its DUV SAQP (Note from this site: Self-Aligned Quadruple Patterning , that is, self-aligned quadruple exposure) technical route is too complicated, so Intel is actively deploying High-NA EUV technology and bought the first High-NA lithography machine.

Dassen pointed out that it is natural for different customers to have different assessments of the timing of introducing High-NA. However, AMSL has received multiple new orders for High-NA EUV lithography machines every quarter.

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