ASML provides technical support to Japanese foundry Rapidus in Hokkaido

News from this site on September 27, according to Nikkei News, ASML, a large Dutch semiconductor manufacturing equipment manufacturer, will build a new technical support base in Hokkaido, Japan, by the second half of 2024.

It is reported that Japan's Rapidus Company is striving to mass-produce the most advanced semiconductors. ASML will provide Rapidus with assistance in factory construction and maintenance inspections, and will increase Japan's domestic personnel by 40% by around 2028 .

ASML is the world's leading manufacturer of lithography equipment and occupies a leading position in the key processes of semiconductor manufacturing. As the only manufacturer in the world that can produce extreme ultraviolet (EUV) lithography machines, ASML is crucial to the mass production of equipment required for cutting-edge semiconductors with 5 to 7 nanometers. Therefore, for Japan's local semiconductor industry, ASML's support is indispensable

ASML will build a technical support base around Chitose City, Hokkaido,It will be built in Rapidus by about 50 technical personnel Install EUV lithography equipment on the semiconductor trial production line to provide assistance for factory construction and maintenance inspection.

According to reports, U.S. Applied Materials plans to increase its workforce in Japan by 60% in the next few years. In addition, the American Lam Research Company (Lam Research) is considering establishing a new facility in Hokkaido

Notes from this site: Rapidus was established in August 2022 by Toyota, Sony, NTT, NEC, SoftBank, and Denso Eight Japanese companies including Denso, KIOXIA and Mitsubishi UFJ Bank jointly invested 7.3 billion yen (currently about 358 million yuan) to establish the establishment. In addition, the Japanese government also provided 70 billion yen (currently about 3.437 billion yuan). RMB) subsidy as R&D budget. The company plans to install chip equipment and start trial production in December 2024, with the goal of mass production of 2nm chips within 4 years (2028 at the latest).

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