iPhone 15 Pro overheating issue: Analyst reveals possible reasons for design compromises

News on September 27, recently, Apple’s iPhone 15 Pro phones have attracted much attention due to overheating issues. However, in response to this issue, the famous analyst Ming-Chi Kuo put forward his unique insights. He believes that the iPhone 15 has nothing to do with the widely speculated TSMC 3nm process. The overheating problem of the Pro is more likely due to the compromises made by Apple in the heat dissipation system in pursuit of a thin and light design, such as the smaller heat dissipation area and the impact of the use of titanium alloy materials on the heat dissipation effect. While Apple is expected to fix the issue via a software update, there may be limitations to the improvement, as increasing cooling efficiency may require reducing processor performance. Ming-Chi Kuo also warned that if Apple cannot properly solve the overheating problem, it may affect the iPhone 15 Pro Series Sales.

Another highlight of the iPhone 15 Pro series is the first use of titanium alloy casing. However, this also raises a series of questions. Some users have reported that the casing of the new phone is prone to scratches, the titanium alloy frame may be discolored, and the drop resistance is not satisfactory. These issues may require Apple to gradually resolve them in future products to improve user experience and product quality. Ming-Chi Kuo’s views have aroused widespread discussion in the industry. His analysis believes that the root cause of the overheating problem is design compromise rather than process technology, which may provide Apple with a direction to solve the problem. However, consumers and the industry still expect Apple to solve these problems as soon as possible to ensure that the iPhone 15 Pro series can succeed in the market. As far as the editor understands, Apple has not yet issued an official response to this issue, but it is expected that they will pay close attention to user feedback and take appropriate measures to resolve these challenges

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