


According to news on September 12, Google will release a new product of the Pixel 8 series on October 4. The most eye-catching highlight is the new Google Tensor. G3 chip. This chip was independently developed by Google and then handed over to Samsung for manufacturing. It uses a leading 4-nanometer process and uses the fan-out wafer-level packaging (FO-WLP) process. The move is thought to be a major boost for Pixel The 8 Series brings greater performance and greater energy efficiency.
It is reported that FO-WLP wafer level packaging is an advanced packaging technology based on BGA technology, which allows multiple packages to be packaged and tested simultaneously at the wafer level. chips and then attach them directly to the substrate. This technology not only helps reduce losses during high-frequency signal transmission, but also effectively reduces the heating of the device. Previously, Qualcomm and MediaTek have adopted similar FO-WLP packaging processes, and both have achieved great success in the field of mobile chips.
The core design of the Google Tensor G3 chip is highly anticipated. It adopts a 9-core design architecture, including 1 Cortex X3 ultra-large core, 4 Cortex A715 large cores and 4 Cortex A510 small cores. In addition, the chip also integrates a 10-core Arm Immortalis G715 GPU and a Samsung Exynos 5G baseband, which will make the Pixel 8 series perform well in terms of performance and 5G connectivity. The release of the Pixel 8 series is highly anticipated. Not only because it will be equipped with the powerful Google Tensor G3 chip, but also because it will bring more innovations and improvements to meet user needs for high-performance smartphones. The release of this series of products will further strengthen Google's competitive position in the smartphone market while also providing consumers with more choices. It is understood that the Pixel 8 series launch conference will be held on October 4, at which time we will learn more about this series of products
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