Sources say Samsung Electronics is testing TEL's Acrevia GCB equipment to improve EUV lithography processes

According to news from this site on September 3, Korean media The Elec reported yesterday that Samsung is testing Tokyo Electron (TEL)’s Acrevia GCB gas cluster beam (this site’s note: Gas Cluster Beam) system. TEL's Acrevia GCB system was released on July 8 this year. It can locally and accurately shape EUV lithography patterns through gas cluster beams, thereby repairing pattern defects and reducing pattern roughness.

Industry insiders believe that TEL's Acrevia system can play a similar role to Applied Materials' Centura Sculpta system, that is, directly shape EUV exposure patterns, reduce costly EUV multiple exposures, and thereby shorten photolithography processes and improve overall profitability.

In addition, the Acrevia system can also be used to eliminate random errors, which account for about half of EUV lithography errors, and improve product yield.

TEL related sources said that potential customers are indeed testing the Acrevia system, and the device is expected to be used first in logic foundry rather than in the memory field.

Samsung Electronics has previously tested Applied Materials’ Centura Sculpta on the 4nm process, and now it is testing TEL’s equipment, aiming to strengthen competition for pattern shaping orders between the two major semiconductor equipment suppliers.

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