Foxconn builds AI one-stop service, and invested Sharp to enter advanced semiconductor packaging: put into production in 2026, designed to produce 20,000 wafers per month

News from this site on July 11, Economic Daily reported today (July 11) that Foxconn Group has entered the advanced packaging field, focusing on the current mainstream panel-level fan-out packaging (FOPLP) semiconductor solution.

1. Following its subsidiary Innolux, Sharp, invested by Foxconn Group, also announced its entry into Japan’s panel-level fan-out packaging field and is expected to be put into production in 2026.

2. Foxconn Group itself has sufficient influence in the AI ​​field, and by making up for its shortcomings in advanced packaging, it can provide "one-stop" services to facilitate the acceptance of more AI product orders in the future.
3. According to public information on this website, Foxconn Group currently holds 10.5% of Sharp’s shares. The group stated that it will not increase or reduce its holdings at this stage and will maintain the existing investment relationship.
4. Sharp announced that it will join hands with Japanese electronic component manufacturer Aoi Electronics to enter the advanced packaging field. Aoi will renovate existing Sharp factories and facilities and build semiconductor packaging production lines.
5. Aoi plans to build an advanced semiconductor panel packaging production line at Sharp's factory in 2024, with a target of full production in 2026, with a monthly production capacity of 20,000 pieces.

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