Following the footsteps of Samsung and Micron, SK Hynix will launch 1bnm 32Gb DDR5 memory chips within the year

According to news from this site on April 25, according to Korean media NEWSIS, SK Hynix stated at today’s first quarter 2024 financial report conference call that it will launch 1bnm 32Gb DDR5 memory particles within the year.

32Gb particles mean that consumer-grade UDIMM and SODIMM can achieve 64GB single capacity; enterprise-grade RDIMM can even achieve single module 128GB without using 3D stacking of through silicon via technology , to meet the server's need for large memory.

SK Hynix announced in May 2023 that it had completed the development of its 1bnm memory. This process uses HKMG technology, which can reduce leakage, improve capacitor performance, and thereby reduce power consumption.

Referring to previous reports on this site, both Samsung Electronics and Micron have officially announced 32Gb DDR5 memory particles. Among them, Samsung’s 32Gb DDR5 DRAM started mass production at the end of last year as planned, and Micron’s corresponding products will also be launched this year.

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