MediaTek: Dimensity chips will empower vivo's latest flagship to be the first to carry a large-scale device-side AI model

MediaTek: Dimensity chips will empower vivo’s latest flagship to be the first to carry a large-scale device-side AI model

MediaTek announced today that it has in-depth cooperation and joint debugging with vivo in the field of AI, taking the lead in realizing the implementation of 1 billion and 7 billion AI large language models, and 1 billion AI visual large models on the mobile phone side.

According to reports, MediaTek Dimensity mobile chip will enable vivo’s latest flagship mobile phone to be the first to carry a large-scale device-side AI model. Generative AI deployed on the terminal side has obvious advantages in protecting user information security, improving real-time performance, and realizing personalized user experience.

MediaTek also stated that the new generation flagship AI processor APU and AI development platform NeuroPilot can significantly improve the operating efficiency of large models on the terminal side and provide powerful AI computing power and power for vivo's terminal-side generative AI applications. performance.

According to reports, vivo will hold the 2023 Developer Conference with the theme of "Together Together" at the Shenzhen International Convention and Exhibition Center on November 1. This conference will release vivo's self-developed AI large model, self-developed operating system, and OriginOS 4.

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