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HomeTechnology peripheralsIt IndustryBaiwei launches uMCP series: integrated memory and flash memory, effectively compressing motherboard space

Baiwei launches uMCP series: integrated memory and flash memory, effectively compressing motherboard space

Oct 11, 2023 pm 05:57 PM
umcpIntegration of memory and flash memoryReduced motherboard space

News on October 11th, China’s storage solution provider Baiwei recently announced the launch of their latest uMCP series of products. This new storage solution integrates memory and flash memory into a single module, with a storage capacity of 8GB memory and 256GB flash memory. In addition, the size of this uMCP chip is only 11.5mm×13.0mm×1.0mm. It is said that compared with the traditional UFS3.1 and LPDDR5 separation solution, it can save up to 55% of the motherboard space

Baiwei launches uMCP series: integrated memory and flash memory, effectively compressing motherboard space

The editor learned that Baiwei’s uMCP chip has two versions to choose from. One version uses LPDDR5 and UFS3.1, and the other version uses LPDDR4X and UFS2.2. The sequential read and write speeds of these two versions can reach 2100MB/s and 1800MB/s respectively, and the highest frequency can reach 6400Mbps

Baiwei launches uMCP series: integrated memory and flash memory, effectively compressing motherboard space

Baiwei said that compared with uMCP based on LPDDR4X Compared with other products, uMCP products based on LPDDR5 fully rely on the self-developed firmware algorithm, coupled with the support of firmware functions such as Write booster, SLC Cache, HID, Deep Sleep, etc., which increases the reading speed by a full 100%, reaching 2100MB/s. At the same time, uMCP products based on LPDDR5 also support functions such as multi-Bank Group mode and the use of WCK signal design, increasing the data transmission rate by 50% from 4266Mbps to 6400Mbps. In addition, with the help of the dynamic voltage scaling (DVFS) function, LPDDR5's VDD2H is reduced from 1.1V to 1.05V, VDDQ is reduced from 0.6V to 0.5V, and the power consumption is reduced by 30%

Baiwei launches uMCP series: integrated memory and flash memory, effectively compressing motherboard space

Baiwei’s uMCP products use multi-layer Die and ultra-thin Die packaging processes to stack and package LPDDR5 and UFS3.1 chips together, thus saving up to 55% of motherboard space. This technological innovation not only simplifies the circuit design of mobile phone motherboards, but also provides more space for increasing battery capacity and optimizing the layout of other motherboard components. In addition, Baiwei officials revealed that uMCP products will also be launched in the future. A larger capacity version with 12GB of memory and 512GB of flash storage. This new storage solution will further meet the market's demand for high-performance, large-capacity storage.

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