Baiwei launches LPDDR5 + UFS3.1 integrated product uMCP, which can save 55% of mobile phone motherboard space

According to news from this site on October 11, domestic storage manufacturer Baiwei announced the launch of uMCP series products, which integrate memory and flash memory into one module. The capacity reaches 8GB 256GB, and the chip size is 11.5mm×13.0mm×1.0 mm, claims to save 55% of motherboard space compared to the solution of separating UFS3.1 and LPDDR5.

Baiwei uMCP chip is available in LPDDR5 UFS3.1 and LPDDR4X UFS2.2 versions, The sequential read and write speed is up to 2100MB/s, 1800MB/s, frequency up to 6400Mbps.

Baiwei said that compared with uMCP products based on LPDDR4X, uMCP products based on LPDDR5 rely on self-developed firmware algorithms and firmware functions such as Write booster, SLC Cache, HID, and Deep Sleep, and the reading speed is increased by 100% to 2100MB/s. At the same time, Baiwei's LPDDR5-based uMCP product supports multi-Bank Group mode and adopts WCK signal design. The data transmission rate is increased by 50% from 4266Mbps to 6400Mbps. Based on the dynamic voltage scaling (DVFS) function, LPDDR5's VDD2H is reduced from 1.1V to 1.05V, VDDQ drops from 0.6V to 0.5V, power consumption is reduced by 30%.

In addition, relying on multi-layer Die, ultra-thin Die and other packaging processes, Baiwei uMCP combines LPDDR5 and UFS3.1 A multi-chip stack package can save 55% of motherboard space, help simplify the circuit design of mobile phone motherboards, and make room for increasing battery capacity and layout of other motherboard components.

This site learned from Baiwei official that uMCP products will also launch

12GB 512GB large capacity version in the future.

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