TSMC releases version 2.0 of the 3Dblox open standard, aiming to simplify 3D chip design

According to news from this site on October 2, according to Taiwanese media "Business Times", TSMC announced the next generation of new 3Dblox 2.0 version open standard at OIP 2023 (Open Innovation Platform Ecosystem Forum). Lu Lizhong, deputy general manager of TSMC's design and technology platform, said that TSMC assists industry integration through alliances and helps customers accelerate their entry into the new era of AI.

It is reported that among the two major AI chip manufacturers, AMD’s MI300 series has begun to introduce the 3Dblox packaging architecture, and NVIDIA’s next-generation GPU B100 is expected to be introduced in the second half of next year.

IC design industry insiders say that the semiconductor industry is moving towards heterogeneous integration and small chip architecture. TSMC’s standardization measures will simplify chip design and help enhance industrial competitiveness. Practitioners pointed out that chip development has been on the track of Moore’s Law in the past, and the key to process breakthroughs lies in 2D-level shrinkage technology. , but with the advent of physical limits, semiconductor efficiency is seeking breakthroughs and entering a new development stage of 3D stacking. After the 2.5D packaging process CoWoS was favored by NVIDIA and the production capacity exceeded demand,

TSMC actively established an open standard for the next generation packaging 3Dblox

, which is expected to shorten the customer's development process from architecture to tape-out.

TSMC Chairman Liu Deyin recently emphasized the importance of the 3D Blox standard. Last year, TSMC launched the 3Dblox open standard, aiming to simplify and modularize 3D IC design solutions for the semiconductor industry. Dr. Yu Zhenhua, deputy general manager of TSMC, revealed that TSMC develops various 3D IC technologies for It is to make the distance between circuits closer and closer. "There is even a possibility in the future that two different chips can grow together." He analyzed that the performance of the semiconductor industry has tripled in the past 15 years, and the trend will continue. This is equivalent to proposing to the global semiconductor industry a TSMC curve that will triple the chip performance in 15 years.

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