


According to news from this site on April 11, according to a research report by TrendForce yesterday, the recent earthquake in Taiwan had an impact of less than 1% on the total DRAM bit output in the second quarter.
There are four memory manufacturers in Taiwan: Micron, Nanya Technology, Power Semiconductor Manufacturing Co., Ltd., and Winbond Electronics. Research reports indicate that these four companies all had a certain number of wafers that needed to be inspected or scrapped after the earthquake.

However, the equipment in these factories have certain earthquake resistance capabilities, which will affect the post-earthquake production capacity. The impact is relatively small, and all production lines have been roughly restored to 100% operation.
Among these four manufacturers, Micron-related product capabilities have been transferred to advanced processes, and the other three currently mainly stay at the 38/25nm node (Note from this site: Nanya Technology also has 10 nm-level product capabilities), with shipments smaller.
Therefore, only Micron will have a certain impact on global DRAM bit output, The total output in the second quarter is expected to decrease by less than 1%.
At present, in terms of the overall market,the DRAM memory spot market has basically resumed quotation, but the contract price has not yet fully started.
In the market segment, in the field of mobile DRAM, SK Hynix has taken the lead in launching quotations to some smartphone manufacturers on the 8th, while Micron and Samsung Electronics have stayed put. The research report predicts that mobile DRAM will maintain a quarterly growth of 3~8% in the second quarter.
In the server memory market, due to the greater impact of Micron's advanced manufacturing processes, the transaction price of Micron's server memory storage may eventually rise. For HBM memory, Micron's main production line in the HBM field is located in Japan and will not be affected.
As for downstream module manufacturers, the two major module companies Kingston and ADATA have restarted spot quotations but have not seen any increase.
TrendForce TrendForce predicts that the earthquake will have a limited effect on DRAM memory prices. DDR3 will have some room for price increases, while the short-term small price increases of DDR4 and DDR5 are expected to return to normal soon.
The above is the detailed content of TrendForce: The earthquake in Taiwan affected DRAM memory shipments by less than 1% in the second quarter. For more information, please follow other related articles on the PHP Chinese website!

1t内存等于1024GB。1t内存是指内存的存储容量为“1TB”,而1TB等于1024GB。但这只是计算机原理中理论上的数值,一般在系统显示可用存储空间中会偏少;因为硬盘制造商对硬盘的定义与计算机对硬盘容量的算法不同,导致硬盘标识容量和操作系统中显示的实际容量存在误差。

gear1和gear2内存模式指的是CPU的内存控制器与内存频率的比例关系;gear1表示内存控制器频率和内存工作频率之比是“1:1”,而gear2表示内存控制器频率和内存工作频率之比是“1:2”,可减轻内存控制器压力,让内存更容易得到更高的频率。

电脑C盘一般留50-80G,由于系统在日后使用当中会产生垃圾文件和缓存文件等,因此建议至少预留50GB-80GB的空间给C盘,如果不习惯在安装软件时选择路径,日常也不经常清理电脑,那么至少需要100GB。

板载内存是指主板上本身集成的内存,是直接焊接在了电脑的主板上无法更换的。板载有“集成”的意思,是指整合于主板芯片中的功能或硬件,主要有板载显卡、声卡、网卡、RAID等。一般板载硬件功能都较简单,不能完全取代独立硬件;但是购买可以控制购买成本。

1tb理论上是等于1024g;其中T是TB的缩写,G是GB的缩写,但是一般内存不会有1TB的,TB级别的是硬盘;TB表示太字节,是一种信息计量单位,现今通常在标示硬盘总容量、或具有大容量的储存介质之储存容量时使用。

内存或磁盘不足,word无法显示请求字体的解决办法:1、打开Word,点击【剪切板】,然后点击【全部清空】;2、在【高级系统设置】中取消勾选“自动管理所有驱动器的分页文件大小”的选项,然后选中需要设置的磁盘盘符,输入合适的大小即可。

硬盘是外存。外存全称“外存储器”,是指除计算机内存及CPU缓存以外的储存器,一般断电后仍然能保存数据;外存通常是磁性介质或光盘,像硬盘,软盘,磁带,CD等,能长期保存信息,并且不依赖于电来保存信息,但是由机械部件带动,速度与CPU相比就显得慢的多。

不够用。虽然4G内存足够满足Windows 10系统的安装需求,但问题是不可能只在电脑里安装一个系统,还要安装其他应用,而这些应用也会占用一定的内存空间;先不考虑CPU、硬盘和显卡等配件是否能够满足需求,只单独说内存,假设用户安装的Windows 10系统占用了2G内存,但其他的辅助插件和应用可能还会占去2G内存,一旦内存被占满,必然会导致电脑出现卡顿、运行慢的情况。


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