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It is reported that Zhuang Zishou will be stationed in the United States next month to promote the construction of TSMC's US factory: sprinting to put into production in 2025

王林
王林forward
2024-04-10 16:52:011029browse

News from this site on April 10, according to the Liberty Times report, TSMC plans to send Dr. Zhuang Zishou to the United States in May this year to cooperate with Wang Yinglang to jointly promote the construction of TSMC’s US factory.

The U.S. Department of Commerce has currently finalized the amount of subsidies for TSMC, Intel, and Samsung, but TSMC’s factories in the United States still have many problems. TSMC’s leadership hopes to promote the implementation of advanced processes as soon as possible by sending Dr. Zhuang Zishou to work with Wang Yinglang, who specializes in production and manufacturing.

Check the content of TSMC’s official leadership team on this site:

Dr. Zhuang Zishou is currently the deputy general manager of factory affairs at TSMC, responsible for the planning, design, construction and maintenance of new factories, and Operation and upgrade of existing factory facilities.

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Dr. Zhuang joined TSMC as an equipment engineer in 1989, and later transferred to the field of factory affairs. He has devoted himself to factory affairs for more than 25 years. Year.

Under the leadership of Dr. Zhuang, we successfully completed the construction of Wafer 15B fab, Nanjing fab and Wafer 18A fab under tight construction schedule. At the same time, we continued to work on the improvement of the factory affairs system. and integration.

"TSMC's supply chain manufacturer commented that Zhuang is "a very courageous factory manager who does what he says". He is very good at supplier communication, coordination and command and dispatch. He is expected to be stationed in the United States. It will help smoother factory construction and factory operations."

TSMC's U.S. factory plans to start trial production at the end of this month, hoping to achieve its 4nm monthly production target of 4,000 wafers and sprint to formal mass production in the first half of 2025.

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