Xiaomi Civi 4 mobile phone revealed, Snapdragon 8 series flagship platform, Leica co-branding, metal middle frame

Thanks to netizens Yuxuezaiyu and Ink_moshui for submitting clues! On February 20th, blogger @digitalchatstation broke the news today that the Xiaomi Civi 4 engineering machine uses the Snapdragon 8 series flagship platform, co-branded with Leica imaging, a 1.5K 2.7D slightly curved dual-hole screen and uses a metal middle frame.

According to blogger @ Smart Pikachu, Xiaomi Civi 4 is expected to be released around May and will adopt a curved screen design. The positioning of the new phone has been improved, and it is benchmarked against the Honor digital series. The image and performance have been improved. In addition, co-branded gift boxes will continue to be launched to corroborate today's revelations. For reference, the previous generation Xiaomi Civi 3 mobile phone was released in May last year. It debuted with the Dimensity 8200-Ultra processor, equipped with a 6.55-inch 2400×1080 OLED hyperbolic screen, and a 71.7mm narrow machine. The body is 7.56mm thick, weighs 173.5g, has a built-in 4500mAh battery, uses a plastic middle frame, and the starting price is 2,499 yuan. Currently, Xiaomi has not officially announced any relevant information about the Civi 4 series of new phones, and will continue to pay attention and bring follow-up reports.

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