


U.S. government to fund advanced packaging industry with $3 billion, aims to become global leader by 2030
According to news from this site on November 21, in order to enhance the competitiveness of the United States in the field of chip packaging, the U.S. government announced on Monday that it will invest approximately US$3 billion (note on this site: currently approximately 21.51 billion yuan) to support the United States. Chip packaging industry, this is the first R&D investment project under the Chip and Science Act.

The last step in integrated circuit production is chip packaging, whose main purpose is to wrap the exposed chip in protective materials and provide features such as connection pins, thermal dissipation, and power management. Package form and materials can be selected based on chip type and application requirements. The technical level and production capacity of chip packaging directly affect the quality and supply of chips
Currently, the United States only accounts for 3% of the world's production capacity in the field of chip packaging. By comparison, China accounts for 38% of the world’s chip packaging capacity. This means that chips made in the United States need to be shipped overseas for packaging. U.S. Undersecretary of Commerce Laurie Locascio said when announcing the investment plan: "Make chips in the United States and then Shipping them overseas for packaging will bring risks to the supply chain and national security, which is unacceptable to us.”
In order to change this situation, the US government decided to start from the "Chip and Of the US$11 billion in R&D funds in the Science Act, US$3 billion will be earmarked for the development of the US chip packaging industry. The funding will be administered by the U.S. Department of Commerce’s National Institute of Standards and Technology, which will build an advanced chip packaging pilot facility and provide funding for new workforce training programs and other projects When announcing the investment plan, O also said that the US government's goal is that by 2030, the United States will have multiple high-volume advanced packaging facilities and become the global leader in batch advanced packaging of the most complex chips. Locascio also said that the U.S. Commerce Department is expected to announce the first materials and substrate funding opportunities for its chip packaging program next year, and that future investments will focus on other packaging technologies and the broader design ecosystem. Inspired by the US Chip Act, many foreign companies have planned to launch packaging projects in the United States. South Korean chipmaker SK Hynix is reportedly planning to invest $15 billion in advanced packaging facilities in the United States. TSMC is also in talks with Arizona to potentially build an advanced packaging plant in the state.Advertising statement: The external jump links (including but not limited to hyperlinks, QR codes, passwords, etc.) contained in the article are used to convey more information and save selection time. The results are for reference only. All articles on the site contain this statement.
The above is the detailed content of U.S. government to fund advanced packaging industry with $3 billion, aims to become global leader by 2030. For more information, please follow other related articles on the PHP Chinese website!

Stay informed about the latest tech trends with these top developer newsletters! This curated list offers something for everyone, from AI enthusiasts to seasoned backend and frontend developers. Choose your favorites and save time searching for rel

This tutorial guides you through building a serverless image processing pipeline using AWS services. We'll create a Next.js frontend deployed on an ECS Fargate cluster, interacting with an API Gateway, Lambda functions, S3 buckets, and DynamoDB. Th

This pilot program, a collaboration between the CNCF (Cloud Native Computing Foundation), Ampere Computing, Equinix Metal, and Actuated, streamlines arm64 CI/CD for CNCF GitHub projects. The initiative addresses security concerns and performance lim


Hot AI Tools

Undresser.AI Undress
AI-powered app for creating realistic nude photos

AI Clothes Remover
Online AI tool for removing clothes from photos.

Undress AI Tool
Undress images for free

Clothoff.io
AI clothes remover

Video Face Swap
Swap faces in any video effortlessly with our completely free AI face swap tool!

Hot Article

Hot Tools

Safe Exam Browser
Safe Exam Browser is a secure browser environment for taking online exams securely. This software turns any computer into a secure workstation. It controls access to any utility and prevents students from using unauthorized resources.

SublimeText3 Linux new version
SublimeText3 Linux latest version

DVWA
Damn Vulnerable Web App (DVWA) is a PHP/MySQL web application that is very vulnerable. Its main goals are to be an aid for security professionals to test their skills and tools in a legal environment, to help web developers better understand the process of securing web applications, and to help teachers/students teach/learn in a classroom environment Web application security. The goal of DVWA is to practice some of the most common web vulnerabilities through a simple and straightforward interface, with varying degrees of difficulty. Please note that this software

SublimeText3 English version
Recommended: Win version, supports code prompts!

Dreamweaver Mac version
Visual web development tools
