Seizing the wave of artificial intelligence, Samsung and Micron step up planning of HBM expansion plan

IT House News on November 8th, in the context of the downturn in the consumer storage market, high-bandwidth memory (HBM) technology has become a new driving force. The latest report points out that Samsung and Micron are actively Prepare to expand HBM DRAM.

Source: Samsung

According to the latest reports, Samsung Electronics has spent 10.5 billion won to acquire some of Samsung Display’s factories and equipment in Cheonan, South Korea, to expand HBM production capacity. In addition, Samsung Electronics also plans to invest 700 billion to 1 trillion won in new packaging lines

IT House previously reported that Mr. Hwang Sang-jun, vice president of Samsung Electronics and head of the DRAM product and technology team, revealed that Samsung has developed HBM3E with a speed of 9.8Gbps and plans to start providing samples to customers.

Samsung is working hard to develop HBM4 technology and plans to launch it in 2025. It is understood that Samsung Electronics is actively researching various technologies for HBM4, including non-conductive film (NCF) assembly technology optimized for high-temperature thermal characteristics and hybrid bonding (HCB).

Micron is also actively preparing for HBM production and opened a new factory in Taichung on November 6. Micron said the new facility will integrate advanced test and packaging capabilities and will be dedicated to high-volume production of HBM3E and other products. The expansion is aimed at meeting the growing needs of various applications such as artificial intelligence, data centers, edge computing and cloud services.

Micron CEO Sanjay Mehrotra revealed that the company plans to start shipping HBM3E in large quantities in early 2024. Micron’s HBM3E technology is currently undergoing certification by NVIDIA. The initial HBM3E products will feature an 8-Hi stack design with 24GB capacity and over 1.2TB/s bandwidth.

In addition, Micron plans to launch the larger capacity 36GB 12-Hi stack HBM3E in 2024. In an earlier statement, Micron had expected the new HBM technology to contribute "hundreds of millions of dollars" in revenue by 2024.

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