Home >Technology peripherals >It Industry >Samsung delivers HBM3E memory sample 'Shinebolt” with bandwidth up to 1.228TB/s
Samsung recently confirmed that it will name its fifth-generation HBM3E product "Shinebolt", according to a news report from Korean media businesskorea
The maximum data transfer speed (bandwidth) of Shinebolt is about 50% higher than HBM3, reaching 1.228TB/s, although Samsung The HBM development and production speed lags behind SK Hynix to some extent, but Samsung still plans to regain the leading position in advanced memory production.
The key to HBM is how each layer is connected. Samsung has been using the thermal compression non-conductive film (TC-NCF) process, while SK Hynix uses the mass reflow molded underfill (MR-MUF) process. However, which process is better still needs to be judged by the market Since Samsung lagged behind SK Hynix in the development and production speed of HBM, they began to re-formulate their strategies to regain market share. Currently, Samsung is considering accelerating the development of HBM’s “hybrid connection” process to change the rules of the game. This site also found that Samsung Memory Business President Li Zhengpei had previously stated: “We are currently producing HBM3 and have successfully developed the next First-generation product HBM3E, we will further expand the production of HBM to meet customer needs." Advertising statement: This article contains external jump links (including but not limited to hyperlinks, QR codes, passwords, etc.) , designed to provide more information and save screening time. The linked results are for reference only. Please note that all articles on this site contain this statementThe above is the detailed content of Samsung delivers HBM3E memory sample 'Shinebolt” with bandwidth up to 1.228TB/s. For more information, please follow other related articles on the PHP Chinese website!