Ming-Chi Kuo predicts: Apple iPhone will use RCC materials as early as 2025

According to the latest news, Apple plans to use resin-coated copper foil (RCC) as a new printed circuit board (PCB) material in the future to produce thinner PCBs. However, according to people familiar with the matter, the technology may face some challenges

In a latest research note, well-known analyst Ming-Chi Kuo pointed out that due to the "fragile characteristics" of RCC materials and "failed to pass the drop test", Apple may not officially adopt this technology in 2024. However, he also said that if Apple and its suppliers can solve the problems related to RCC materials by the third quarter of 2024, then this technology is expected to be applied to devices such as iPhone 17 Pro for the first time

Currently, PCBs for devices such as iPhones are made of flexible copper-based materials. Adopt thinner RCC The PCB will provide more valuable internal space for these compact devices, which means that larger-capacity batteries or other components can be accommodated, further improving device performance and battery life.

Although RCC technology faces some challenges, Apple is still constantly exploring new materials and technologies to continuously improve the performance and design of its products. In the future, we'll have to wait and see if Apple can overcome the issues with RCC materials and implement them into upcoming iPhones 17 Pro and other devices.

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