Samsung wins new 3nm high-performance server chip foundry order

Samsung Electronics began mass production of 3nm chips in June last year, but there were only a few customers. The source of orders that have been exposed so far seems to be only an unnamed Chinese customer

Korean semiconductor design company AD Technology has announced that it has signed a contract with an overseas customer, which is based on the 3nm process manufactured by Samsung. Server chip design project. This is also the first time that Samsung Electronics has confirmed that it has obtained 3nm customers through a design company.

ADTechnology did not disclose the identity of the customer, but it is said that the customer is a U.S. high-performance computing (HPC) chip company

Executive Vice President of Samsung's foundry business unit and head of the business development team Gibong Jeong, CEO, said: "We are pleased to announce the collaboration with our reliable partner ADTechnology on the 3nm design project. Our joint efforts will serve as an excellent example of collaboration within the SAFE ecosystem. We look forward to the opportunity for closer collaboration "This 3nm project will become one of the most important ASIC products in the industry," said JK Park, CEO of ADTechnology. Our design experience will be the key to distinguishing us from other competitors. We will go all out to provide high-quality design solutions to our customers.”

#Different from the fin field effect transistor (FinFET) architecture used in 7nm, 5nm and other processes, Samsung Electronics' 3nm process technology is the first to adopt the all-around gate transistor GAA architecture. Samsung Electronics stated that their first-generation 3nm process technology has achieved 45% improvement in energy efficiency, 23% performance improvement and 16% area reduction (PPA) compared to 5nm. In addition, Samsung's new generation 3nm process SF3 has achieved a 22% frequency increase, 34% energy efficiency improvement and 21% area reduction compared to the 4nm FinFET platform.

Samsung will focus on 3nm production in 2023-2024 , namely SF3 (3GAP) and its improved version SF3P (3GAP), its production yield can be maintained in the range of 60-70% initially, and the company also plans to start launching its 2nm level node in 2025-2026.

After both Samsung and TSMC have entered the era of the 3nm process, the 3nm process will become the mainstream of the foundry market in the future. Therefore, it is expected that by 2025, the output value of the 3nm process market will reach as high as 25.5 billion U.S. dollars (note on this site: currently about 176.205 billion yuan), exceeding the estimated output value of 19.3 billion U.S. dollars at the time of 5nm.

Source UnsplashAccording to data from market research agency TrendForce, in the third quarter of 2022, TSMC’s global wafer The foundry market still occupies 53.4% ​​of the market share, firmly ranking first, while Samsung ranks second with a market share of only 16.4%. Therefore, under fierce market competition, the 3nm process will become the key to the main competition between the two companies in the future

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"It is reported that the 3nm yield rate of Samsung and TSMC is about 50%, It is expected to affect the competition for orders next year"

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