Intel CEO reveals future plans: using stacked cache technology to improve performance

On September 20th, Intel CEO Pat Gelsinger revealed important information about the company’s future plans at an innovation event. This information shows that Intel will use stacked cache technology to improve the performance of its chips. Although it is different from AMD's 3D cache, it is also significantly competitive.

It is understood that Intel plans to introduce stacked cache technology in future chips, which will be an important innovation in its products. Although different from the 3D used by AMD V-Cache technology, but Intel’s stacked cache will be used to improve CPU computing performance, which is critical to meeting growing computing needs.

Kissinger pointed out that although this technology is different from AMD’s 3D V-Cache is different, but Intel has advantages in next-generation memory architecture and 3D stacking. This means that they plan to apply this technology on a variety of chips, whether it is a small chip or a large package chip for AI and high-performance servers, Intel has the ability to provide a full range of technical support.

In addition, Gelsinger also mentioned that unlike AMD’s 3D V-Cache technology, this stacked cache technology will not be launched together with Intel’s Meteor Lake chips. Meteor Lake is an important product for Intel's future, but it doesn't appear to include this specific caching technology.

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