MediaTek and TSMC successfully break through the 3nm process, Dimensity flagship chip is on the way

News on September 7th, MediaTek and TSMC jointly announced today that the first Dimensity flagship chip produced using TSMC’s 3nm process has made exciting progress. The results of this important collaboration have attracted widespread attention in the technology field.

According to the news, TSMC’s 3-nanometer process technology provides a powerful support platform for high-performance computing and mobile applications. Compared with the previous 5-nanometer process, the logic density of 3-nanometer process technology has increased by about 60%. Under the same power consumption, the performance has increased by 18%, or the power consumption has been reduced by 32% at the same performance level. This means that future chips will achieve significant improvements in performance and efficiency.

According to the editor’s understanding, MediaTek stated that the first Dimensity flagship chip using TSMC’s 3nm process is planned to be officially launched in the second half of 2024. This news triggered the industry's expectations for future mobile devices and high-performance computing.

It is worth noting that not only MediaTek and TSMC have made progress in the 3-nanometer process, but other chip manufacturers in the industry are also actively tackling the problem. It is reported that Apple is expected to be the first to use TSMC's 3nm production capacity and apply it to the latest A17 chip. In addition, there is currently no definite news about Qualcomm’s 3-nanometer chips, but it is expected to compete with MediaTek to bring more innovation and competitiveness to the market. The competitive landscape of the entire chip industry will undergo significant changes as a result, and consumers can expect to enjoy greater performance and efficiency in future mobile devices and computers.

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