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3nm process challenges: Apple A17 Bionic and M3 chips face yield difficulties

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2023-07-16 18:37:15925browse

According to news on July 16, it is understood that Apple and TSMC have reached a special agreement to produce A17 Bionic and M3 chips have reserved 90% of TSMC’s 3nm process wafers. However, the yield rate of this advanced process is currently only 55%, which means that nearly half of the wafers cannot be used for Apple products.

According to Brett, senior analyst at Arete Research Simpson, there is a special agreement between Apple and TSMC. Under the agreement, Apple only pays for qualified wafers, rather than standard pricing. According to reports, standard wafer prices may be as high as US$17,000 (approximately 122,000 yuan) per piece, but TSMC may only start implementing this business model for Apple in the second half of 2024.

3纳米制程挑战:苹果A17 Bionic和M3芯片面临良率困境

3 Nano process is one of the most advanced chip manufacturing technologies at present, which can improve the performance and efficiency of chips while reducing power consumption and costs. Apple plans to launch A17 using this process Bionic and M3 chips, the former of which will be used in iPhone 15 Pro and iPhone 15 Pro Max. TSMC expects to be able to produce 100,000 3-nanometer wafers per month by the end of 2023 to meet Apple's needs. However, at the current yield of 55%, only 55,000 wafers are available. Apple will only pay standard wafer prices when the yield reaches 70%, but according to reports, this may not happen until the first half of 2024.

In addition, there are rumors that Apple may switch to N3E, another 3-nanometer process from TSMC in 2024, which is said to have better yields and lower production costs. However, this could also result in the A17 The performance of Bionic and M3 chips has dropped, so Apple has not made a decision yet.

It is worth mentioning that this special agreement will allow Apple to continue to maintain stable supply in the face of low yields in the 3-nanometer process, while reducing the loss and cost of substandard wafers. Apple and TSMC will continue to deepen their cooperation, aiming to promote technological progress and innovation and provide consumers with a more advanced product experience.

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