What chip does Huawei p50pro use?

There are two types of Huawei P50Pro mobile phone chips: 1. Qualcomm Snapdragon 888 chip, based on Samsung's 5nm process, GPU Adreno 660, using X60 5G modem baseband, supporting WiFi 6E, Bluetooth 5.2. 2. Hainan The Kirin 9000 chip is built on a 5nm process and integrates up to 15.3 billion transistors, including a 3.13GHz A77 large core, three 2.54GHz A77 medium cores, and four 2.04GHz A55 small cores.

The operating environment of this tutorial: HarmonyOS 2 system, HUAWEI P50 Pro mobile phone.

HUAWEI P50 Pro is a smartphone released by Huawei on July 29, 2021; available in cloud brocade white, Danxia orange, galaxy blue, cocoa tea gold, snowy white, dawn pink, and obsidian gold There are 9 colors including black, rippling clouds, and the vast ocean.

There are two types of Huawei P50Pro mobile phone chips: one uses the Snapdragon 888 processor, and the other uses the Kirin 9000 chip.

• Huawei P50 Pro Qualcomm Full Netcom Edition is equipped with Qualcomm Snapdragon 888 4G processor.

• Huawei P50 Pro Kirin Full Netcom Edition is equipped with Huawei HiSilicon Kirin 9000 4G processor.

Processor

Kirin 4G full network version: Kirin 9000 CPU: Octa-core, 1xCortex-A77@3.13GHz 3xCortex-A77@2.54GHz 4xCortex-A55@2.05GHz GPU: 24-core Mali-G78 NPU: Dual Large-core NPU Micro-core NPU (Neural Network Processing Unit) Qualcomm 4G Full Netcom Edition: Snapdragon 8884G CPU: eight cores, 1xCortex-X1@2.84G Hz 3xCortex-A78@2.42GHz 4xCortex-A55@1.8GHz GPU: Adreno660 AI: Qualcomm 6th Generation AI Engine

Qualcomm Snapdragon 888

Snapdragon 888 is a mobile phone processor owned by Qualcomm, which was officially released on December 1, 2020 , the global premiere of Xiaomi Mi 11.

On December 1, 2020, at the Snapdragon Technology Summit held in Hawaii, Qualcomm announced the launch of the latest generation of flagship SoC-Qualcomm Snapdragon 888 5G mobile platform and Snapdragon X60 5G baseband. This is For the first time, the company has integrated a 5G modem in its 8-series processors.

For the first time for Qualcomm's top 8-series chipsets, the Snapdragon 888 is a major improvement for 5G: it will finally offer a fully integrated 5G modem, unlike the Snapdragon 865 (which contains separate modem chip).

Snapdragon 888 will use Qualcomm’s Snapdragon X60 modem announced earlier in 2020, which uses a 5nm process for better power efficiency and improved 5G carrier aggregation across mmWave and 6GHz Spectrum for the following frequency bands. Supports global multi-SIM cards, supports SA independent, NSA non-independent and dynamic spectrum sharing. Between the new 5nm architecture and the power efficiency improvements brought by the integrated modem, the new chips appear to offer some substantial battery life improvements when it comes to 5G.

In addition to 5G improvements, Qualcomm also previewed several other advancements coming to the Snapdragon 888, including a sixth-generation AI engine (running on a "redesigned" Qualcomm Hexagon processor) and a second-generation AI engine. A generation sensing hub, the engine promises big jumps in performance and power efficiency for AI tasks. The company promises 26 TOPS. In terms of games, Qualcomm will launch the third generation of Snapdragon Elite Gaming, which will also bring "the most significant upgrade in Qualcomm Adreno GPU performance", supporting 144fps games and desktop-level rendering.

Finally, Qualcomm previewed the new photography features that Snapdragon 888 will enable, including support for faster gigapixel processing speeds thanks to the updated ISP, allowing users to shoot at 2.7 billion pixels per second. Photos and videos are captured at 120 frames per second and each frame is 12 million pixels. Qualcomm said that the image processing is 35% faster than the previous generation.

The Snapdragon 888 is based on Samsung’s 5nm process. The CPU uses 1 x 2.84GHz (ARM’s latest Cortex X1 core) 3 x 2.4GHz (Cortex A78) 4 x 1.8GHz (Cortex A55), and the GPU is Adreno 660. , using X60 5G modem baseband, supporting WiFi 6E and Bluetooth 5.2.

HiSilicon Kirin 9000

The Kirin 9000 chip is a mobile phone SOC based on the 5nm process released by Huawei at 20:00 on October 22, 2020. It is based on 5nm It is built using advanced manufacturing processes and integrates up to 15.3 billion transistors, including a 3.13GHz A77 large core, three 2.54GHz A77 mid-cores, and four 2.04GHz A55 small cores, with a maximum frequency of up to 3.13GHz.

The Kirin 9000 chip contains three specifications: Kirin 9000, Kirin 9000E and Kirin 9000L.

##1*A77@3.13GHz 2*A77@2.54GHz 3*A55@2.05GHz22-core Mali-G78One large core micro-core NPU (Neural Network Processing Unit)For more related knowledge, please visit the

Kirin 9000 and Kirin 9000E Kirin 9000L and parameters

Processor model	CPU	GPU	NPU
##Kirin 9000	1*A77@3.13GHz 3*A77@2.54GHz 4*A55@2.04GHz	24 core Mali-G78	Dual large-core micro-core NPU
Kirin 9000E	1*A77@3.13GHz 3* A77@2.54GHz 4*A55@2.04GHz	22-core Mali-G78	One big core and one small core NPU
Kirin 9000L

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