With an output value of US$250 billion in 2023, TSMC proposes the concept of "OEM 2.0": covering packaging, testing, photomasks, etc.

According to news from this website on July 19, TSMC launched the concept of "wafer foundry 2.0" at its second quarter financial report conference held yesterday, further including packaging, testing, photomask manufacturing and other fields, hoping to re- Define the foundry industry. Wei Zhejia said that TSMC's 3 nm and 5 nm demand is strong. This year, AI and smartphones will have great demand for advanced processes. The wafer foundry market will grow by 10% year-on-year in 2024. This site quotes data from research firm TrendForce. According to the traditional definition of foundry, TSMC’s market share in the first quarter was 61.7%.

Wei Zhejia: TSMC leads the wafer foundry market

1. TSMC wafer foundry market share

According to the new wafer foundry definition, TSMC’s wafer foundry business market share in 2023 28%, and is expected to further increase this year.

2. "Wafer Foundry 2.0" Concept

Based on the existing wafer foundry, the "Wafer Foundry 2.0" concept also covers:

1. Packaging
2. Testing
3. Photomask production ( In the IC production process, photolithography technology is used to form patterns on semiconductors)
4. IDM industry that does not include memory manufacturing

3. The reason why TSMC promotes "wafer foundry 2.0"

TSMC promotes "wafer foundry 2.0" One of the reasons for "Industry 2.0" is that IDM manufacturers have intervened in the foundry market, and the boundaries of wafer foundry are gradually blurring.

TSMC believes that the new definition can better reflect TSMC’s expanding market opportunities (addressable market). TSMC will only focus on the most advanced back-end technologies to help customers create forward-looking products.

TSMC believes that under the new definition, the wafer manufacturing output value in 2023 will be close to US$250 billion, while the old definition was about US$115 billion.

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