What does pad on chip mean?

What is the pad on the chip (Pad)

In chip design, the pad refers to the metal contacts on the chip used to connect external components or components. They are located on the surface of the chip and are designed to mate with corresponding pads on the printed circuit board (PCB).

Function of the pad

• Electrical connection: The pad provides the electrical connection, allowing the chip to interact with external circuitry.
• Mechanical fixing: The pads fix the chip on the PCB through solder joints to ensure reliable mechanical connection.
• Thermal management: The pads can be used as heat dissipation paths to help the chip dissipate heat.

Pad design

The design of the pad is crucial because it affects the reliability and performance of the chip. Pad design generally needs to consider the following factors:

• Size:The pad size must be large enough to provide sufficient connection area and ensure a solid soldering.
• Shape:The pad shape can be round, square or other shapes, depending on the application requirements.
• Surface treatment: The pad surface is usually treated, such as tin or gold plating, to improve solderability.
• Spacing: The spacing between adjacent pads must be sufficient to prevent solder joints from shorting.

Pad Types

There are different pad types, including:

• Through hole pads: The pad that passes through the chip to the other side is used for multi-layer interconnection.
• Surface mount pad: The pad located on the surface of the chip, used for surface mount components.
• Ball Grid Array (BGA) pad: A grid of spherical solder pads arranged on the bottom of a chip.

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