Intel delays opening of new Ohio wafer fab to 2027~2028

According to a difficulty report submitted by Intel to the U.S. Ohio government, the commissioning of the company's two new wafer fabs in the state has been delayed to 2027 to 2028. The delay could impact economic development and job opportunities in the state.

According to documents submitted by Intel, both Fab1 and Fab2 of the Ohio No. 1 project are scheduled to be completed in 2026~2027, approximately one year. It will be officially put into operation later this year.

Documents show that Intel has invested $1.5 billion in the first phase of Ohio projects by the end of 2023, and plans to continue to invest an additional $3 billion.

Compared with previous reports on this site, The scale of construction currently promised by Intel has been significantly reduced, and the progress has been significantly delayed: Intel previously stated that it would invest US$20 billion in these two wafer fabs. The target is to go online in 2025.

In terms of specific progress, Intel has completed the site leveling and excavation work for the first phase of the project, rainwater management has been basically completed, 70% of the electricity, water, and gas infrastructure have been completed, and the construction of the on-site concrete mixing station has been completed. At the same time, the installation of the precast concrete crane was realized.

In addition, according to the local media "Columbus Express", Intel has launched a plan to transport very large equipment from the Manchester Terminal on the Ohio River to two wafer fab sites. Some of the equipment weighs up to about 41 tons, and the entire transportation process will take several months.

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