TSMC has added orders for production equipment, and its monthly CoWoS packaging production capacity is expected to reach 40,000 wafers by the end of this year

News from this site on March 13, according to MoneyDJ reports, TSMC has recently added a new round of production equipment orders and requires delivery in the fourth quarter of 2024, indicating that TSMC will further boost the monthly production capacity of CoWoS packaging.

##TSMC has almost expanded its CoWoS packaging production capacity before, and plans to have a monthly production capacity of 35,000 wafers by the end of 2024,

After additional orders for production equipment, the monthly production capacity is expected to reach 40,000 wafers by the end of the year.

The report states that TSMC is fully committed to CoWoS production capacity, with the goal of doubling its growth in 2024, and will continue to expand in 2025.

In early 2023, TSMC plans to move some of its InFO production lines from the Longtan factory to Nanke to free up space for production expansion. Subsequently, the Taichung AP5 factory also decided to use part of the space originally planned for the expansion of CoWoS to expand the WoS production line, and decided to expand the CoW production line. In addition, the company is also evaluating whether to increase the production capacity of Tongluo Plant and Chiayi Plant to meet market demand.

News shows that TSMC plans to restart orders for CoWoS production equipment from April 2023, and has increased orders in June and October last year. The latest news is that they are increasing orders again this month and delivery is expected in the fourth quarter.

Apple plans to introduce SoIC process and combine it with Hybrid molding technology. This plan is another important move after AMD. Currently, Apple is conducting preliminary small-scale trial production.

In order to meet customer needs, TSMC has been continuously adjusting its production capacity planning. At the end of last year, SoIC's monthly production capacity was about 2,000 pieces, and it is planned to reach nearly 6,000 pieces by the end of this year. By 2025, their monthly production capacity target will more than double again, and is expected to reach 14,000 to 15,000 pieces.

The original address of the report is attached to this website. Interested users can read it in depth.

The above is the detailed content of TSMC has added orders for production equipment, and its monthly CoWoS packaging production capacity is expected to reach 40,000 wafers by the end of this year. For more information, please follow other related articles on the PHP Chinese website!