Redmi G Pro 2024 See you on March 4th, with ice cooling and violent engine PC version support

Redmi officially announced today that the new Redmi G Pro 2024 will be officially released on March 4. In other words, next week we will have the release of this exciting new product.

Redmi G Pro 2024 makes its full debut as an e-sports flagship, deeply integrating the capabilities of the mobile phone industry into the notebook business, presenting 210W super performance release, and Redmi performance reaching a new high. Equipped with i9-14900HX processor and RTX 4060 graphics card, it perfectly combines e-sports and creation to achieve dual evolution.

From this point of view, the performance of this new product will be improved again, and the actual effect is exciting.

The official preview mentioned that the new Redmi G Pro 2024 brings the PC version of Fury Engine. Empowered by mobile phone technology, the three major sub-engines collaborate. 210W performance release, high energy consumption and stable output for 1 hour.

Redmi G Pro 2024 is equipped with ice-sealed heat dissipation for the first time, with overall planning of thermal conductivity efficiency, heat equalization method, and heat source flow, to achieve Redmi’s ultimate Strong performance release.

Three-dimensional VC heat dissipation, heat uniformity performance is 2.5 times that of traditional heat pipes; liquid gold thermal conductive material, thermal conductivity efficiency is 2.35 times that of traditional phase change materials; self-developed CPU&GPU heat distribution channel, accelerates heat source transfer; 3D mesh The heat pipe increases the extremely fine mesh structure and accelerates the change of gas and liquid.

Among them, the higher the thermal conductivity of liquid gold, the stronger the fluidity. Once offset, it will lead to heat dissipation failure, so it is necessary to find the best balance between the two. The thermal conductivity of the liquid gold selected by Redmi is 2.35 times that of traditional phase change materials. The overall thermal conductivity is closer to a paste, which can greatly reduce the risk of offset.

also adopts double protection technology. The first is to design a silicone sealing ring around the processor to prevent liquid gold from spilling; the second is to use dispensing sealing technology for the devices around the processor to prevent Liquid gold corrodes and conducts electricity.

For heat dissipation components that are in contact with liquid gold, the surface is plated with a layer of nickel alloy to protect the radiator from corrosion by liquid gold. We also conducted 12 special tests on the entire machine for liquid gold to ensure reliability and stability for daily use.

At the same time, Redmi also brings a 2-year liquid gold after-sales warranty, enjoying the same 2-year after-sales warranty as the entire machine.

In addition, the Redmi brand general manager and Redmi brand spokesperson also warmed up the new product and responded to liquid gold-related issues that many users are concerned about.

It mentioned: "I saw many students discussing liquid gold. As mentioned in my article just now, we spent a long time to find an optimal balance point on liquid gold, which ensures The stronger thermal conductivity is 2.35 times the heat dissipation capacity of traditional phase change materials (silicone grease in the popular sense), and also greatly solves the risk of easy flow."

# In addition, a Xiaomi notebook product configured with the i5-14500HX RTX 4060 version has previously appeared in the Geekbench benchmark database, and relevant speculation suggests that it should be the Redmi G Pro 2024.

Based on the official preheating information, this new notebook product should provide multiple processor versions. Interested users can stay tuned.

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