Cooler Master announces V8 3DVC radiator: using 3D VC vapor chamber, cooling power consumption 300W

According to news from this site on January 5, Cooler Master today announced the new V8 3DVC radiator, which is expected to be displayed at CES 2024 next week.

According to reports, this radiator is based on V8, uses new vapor chamber technology and superconducting heat pipe technology, and Equipped with two 120mm Mobius fans with 300W heat dissipation capability.

The official introduction of the Cooler Master V8 3DVC radiator attached to this site is as follows:

Optimized for high-performance CPU: capable of dissipating heat up to 300W.

Redesigned vapor chamber: for even heat transfer.

Superconducting composite heat pipe technology: The maximum heat transfer amount is almost doubled to achieve maximum heat transfer efficiency.

Stylish and functional design: beautiful and complements the chassis components.

Efficient Heat Transfer and Cooling: Keeps your CPU at optimal temperature even under heavy load.

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