A major breakthrough in video memory technology, it is reported that SK Hynix will launch a 2.5D fan-out packaging solution next year

According to news from this site on November 28, according to Korean media Business Korea, SK Hynix plans to release a "2.5D fan-out" integrated memory chip packaging solution next year to realize the connection between the two chips. End-to-end connectivity.

The packaging scheme is to place two DRAM chips horizontally side by side and combine them into one chip. The advantage of this solution is that no substrate is added under the chip, making the finished microcircuit thinner.

This site quoted the Korean media report that TSMC has been using a similar arrangement to integrate different chips since 2016, and applied In Apple's processor production, storage manufacturers have not paid attention to this technology before.

Vertical integration of HBM-type memory chips can significantly increase interface bandwidth, but the cost is high. The "2.5D fan-out" developed by SK Hynix can effectively reduce the cost of producing DRAM chips and is expected to Used in GDDR video memory of gaming graphics cards.

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