Report says NAND technology gap between China and South Korea shortens to 2 years

News from this website on November 23, according to Korean media Business Korea, market insiders revealed that as mainland China increases its support for the memory industry, great progress has been made in the past few years, in terms of NAND flash memory , the technology gap between and global leading companies such as Samsung and SK Hynix has been shortened to 2 years.

The industry insider pointed out: "Although DRAM still maintains a technology gap of more than 5 years, due to the low technical barriers of NAND, Chinese companies are quickly catching up with strong support and constantly narrowing the gap. Chinese companies' Although NAND products still have shortcomings in market competitiveness, they have obviously accelerated their pace of catching up."

The report specifically mentioned Yangtze Memory. The company officially released the fourth-generation 3D TLC NAND flash memory chip based on the Xtacking 3.0 (Xtacking 3.0) architecture at the 2022 Flash Memory Summit (FMS). for X3-9070.

After Yangtze Memory announced the mass production from 176 to 232 layers, it encountered many doubts from the outside world. However, the company took less than a year to successfully mass produce the X3-9070.

TiPlus7100 series SSD is not only used in Hikvision’s CC700 2TB SSD, it is also the first 200-layer 3D NAND flash memory solution to enter the retail market plan, ahead of Samsung, Micron, SK Hynix and other manufacturers

The report also pointed out that as the miniaturization of semiconductor circuits approaches the limit, Chinese companies are seizing the opportunity of advanced packaging (Efficient packaging) to further shrink technology gap.

In the semiconductor industry, advanced packaging is seen as the key to overcoming challenges. It mainly packages multiple chips to improve performance

Mainland China occupies the second largest share in the field of semiconductor packaging In terms of market share, this site cites data from market research company IDC. Last year, three companies, Changdian Technology, Tongfu Microelectronics and Huatian Technology, entered the top 10 semiconductor packaging (OSAT) companies in the world, while none of them were in South Korea. The company appears on the list. Advertising Statement: This article contains external jump links (including but not limited to hyperlinks, QR codes, passwords, etc.), which are intended to provide more information and save screening time, but are for reference only. Please note that all articles on this site adhere to this statement

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