MediaTek releases Dimensity 8300 mobile processor, integrating generative AI technology and high energy efficiency features

MediaTek held a new product launch conference today, and launched the new Dimensity 8300 5G AI mobile chip at the conference

The official introduction shows that as a new member of the Dimensity 8000 series family, the Dimensity 8300 has advanced generative AI technology and high energy efficiency features, as well as an excellent gaming experience and high-speed and stable network connection capabilities.

It is reported that the Dimensity 8300 uses TSMC’s second-generation 4nm process and is based on the Armv9 CPU architecture. The eight-core CPU includes 4 Cortex-A715 performance cores and 4 Cortex-A510 energy efficiency cores. The peak CPU performance is 20% higher than the previous generation. , power consumption is saved by 30%.

The Dimensity 8300 chip has a built-in six-core Mali-G615 GPU. Compared with the previous generation, the peak GPU performance has increased by 60% and the power consumption has been reduced by 55%

Dimensity 8300 is the first among its peers to support generative AI, supporting up to 10 billion parameter AI large language models.

This chip integrates the MediaTek AI processor APU 780 and is equipped with a generative AI engine. The performance of integer operations and floating point operations is 2 times that of the previous generation. It supports Transformer operator acceleration and mixed precision INT4 quantization technology. The overall AI performance is 3.3 times that of the previous generation.

Dimensity 8300 adopts MediaTek’s latest generation “Star Speed ​​Engine”, which can allocate resources in real time based on the application’s performance requirements and device temperature information

Starspeed Engine not only cooperates extensively with game applications, but will also expand ecological cooperation with more types of applications and upgrade users’ APP experience.

At the same time, Dimensity 8300 supports flagship LPDDR5X 8533Mbps memory, UFS 4.0 flash memory and multi-circular queue technology. The memory transfer rate is increased by 33% compared with the previous generation, and the flash memory read and write rate is increased by 100%.

Equipped with a 14-bit HDR-ISP Imagiq 980 image processor, it can not only record clearer and sharper 4K60 HDR videos, but also get longer battery life.

Dimensity 8300 also has a built-in 3GPP R16 5G modem, which can be optimized according to specific scenarios to achieve a smoother 5G connection in a weak signal network environment. In addition, it also enhances the connection performance and coverage of Sub-6GHz networks, supports 3 carrier aggregation, and the theoretical peak downlink rate is as high as 5.17Gbps

This device supports MediaTek 5G UltraSave 3.0 power-saving technology, which can reduce 5G communication power consumption by up to 20%. At the same time, it also has Wi-Fi 6E performance enhancement function and supports 160MHz bandwidth. In addition, the device also supports Wi-Fi Bluetooth hyper-connection technology, which enables lower latency when the smartphone is simultaneously connected to peripherals such as Bluetooth headsets and wireless controllers

As for the specific equipment of the new phone, official information from MediaTek shows that smartphones using MediaTek Dimensity 8300 mobile chip are expected to be launched by the end of 2023.

At the same time, Redmi officially announced: "Redmi Strong performance AI computing power, K70 series, see you this month! ” and officially confirmed that Redmi K70E will launch Dimensity 8300-Ultra globally.

Redmi brand general manager Lu Weibing mentioned more product details in the latest warm-up.

Redmi cooperated with MediaTek and launched the 8300-Ultra with a running score of 150W. Similar to Dimensity 9300, it has an AI architecture and supports AIGC implementation. In addition, Redmi K70E is equipped with Hyper OS for the first time, becoming the first application of the Dimensity platform

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