Dimensity 8300 released: CPU and GPU performance surpass 8Gen2, achieving flagship-level generative AI capabilities

Dimensity 9300 has recently taken the lead in the field of flagship mobile phone chips, successfully surpassing its competitors. In the sub-flagship market with high shipment volume, MediaTek has shown new competitiveness

On the afternoon of November 21, MediaTek officially released the new generation of sub-flagship chip Dimensity 8300. The new generation of chips has been greatly improved in terms of performance, energy efficiency and generative AI, achieving a flagship-level experience.

During the event, Dr. Li Yanji, deputy general manager of MediaTek’s Wireless Communications Division, said: “Dimensity 8300 has highly energy-efficient end-side AI capabilities and supports flagship-level storage. , providing excellent gaming, imaging, and multimedia entertainment experiences, and with comprehensive platform innovation, it will open up more new opportunities for the high-end smartphone market."

Dimensity 8300 adopts a 4-core design and uses Armv9 CPU The architecture is based on TSMC’s second-generation 4nm process technology. This eight-core CPU contains 4 Cortex-A715 performance cores and 4 Cortex-A510 energy efficiency cores. The peak performance of the CPU is increased by 20% compared with the previous generation (Dimensity 8200), and the power consumption is saved by 30%. Compared with Qualcomm's Snapdragon 8Gen2, the multi-core performance is 7% higher

In terms of GPU, Dimensity 8300 is equipped with a 6-core GPU Mali-G615, with peak GPU performance Compared with the previous generation, it is improved by 60% and power consumption is saved by 55%. This generation of GPU has greatly improved: Compared with the previous generation, the power consumption of the same performance of the GPU can be reduced by 55%, and the peak performance is increased by 60%. Compared with the Snapdragon 8Gen2, which is famous for its strong GPU performance, the performance of the Dimensity 8300 is also much better. 10%.

MediaTek said that in terms of the performance of high-load applications such as open-world mobile games, the performance of Dimensity 8300 has obvious advantages over Snapdragon 8Gen2.

Dimensity 8300 is equipped with MediaTek’s new generation “Star Speed ​​Engine”. Through a unique performance algorithm, it can perform real-time resource scheduling based on the application’s performance requirements and device temperature information, allowing users to obtain higher frame rates. , low power consumption and long battery life gaming experience.

At this press conference, MediaTek stated that Starspeed Engine has cooperated with game application developers and is expanding ecological cooperation with more types of applications. In short video applications such as Douyin, Starspeed Engine’s adaptive control technology has successfully increased the frame rate of ultra-high-definition video effects by 15%, and the video synthesis speed has also increased by 6%.

Many have been released this year Flagship mobile phones all support generative AI applications. Such functions rely on powerful mobile computing power, so that last year's flagship models were not capable of it. Dimensity 8300 is the first in its class to support generative AI capabilities, supporting up to 10 billion parameter AI large language models.

According to reports, the chip integrates the MediaTek AI processor APU 780 and is equipped with a generative AI engine. The performance of integer operations and floating point operations is twice that of the previous generation, and it supports the same capabilities as the previously released Dimensity 9300. Transformer operator acceleration and mixed-precision INT4 quantization technology, the overall AI performance is 3.3 times that of the previous generation, and can smoothly run innovative applications of terminal-side generative AI. On the AI ​​Benchmark benchmark test, Dimensity 8300 scored 23% higher than Snapdragon 8Gen2.

MediaTek said that the AI ​​capabilities of Dimensity 8300 can enable the phone to implement intelligent assistants, offline translation, intelligent search of photo albums, personalized cultural images and magic editing of pictures (such as removing passers-by) etc.) and other functions. MediaTek is cooperating with Xiaomi to jointly create a device-side generative AI experience, optimizing and realizing application directions including text generation of pre-trained large models, text graphics and AI real-time subtitles

In addition, Dimensity 8300 also has The following features:

• Supports LPDDR5X 8533Mbps memory, supports UFS 4.0 flash memory and multi-circular queue technology (Multi-Circular Queue, MCQ). The memory transfer rate is increased by 33% compared to the previous generation, and the flash memory read and write rate is increased by 100%.
• Equipped with a 14-bit HDR-ISP Imagiq 980 image processor, it improves the terminal’s computational photography performance and upgrades the photo and video recording experience. Not only can users easily record clearer, sharper 4K60 HDR video, but they can also get longer battery life.
• Integrated 3GPP R16 5G modem to provide a faster and more stable 5G network experience. Dimensity 8300 is optimized for specific scenarios to achieve smoother 5G connections in weak signal network environments. It also enhances the connection performance and range of Sub-6GHz networks, supports 3 carrier aggregation, and the theoretical peak downlink rate can reach 5.17Gbps.
• Supports MediaTek 5G UltraSave 3.0 power-saving technology, which can reduce 5G communication power consumption by up to 20%.
• Wi-Fi 6E has enhanced performance and supports 160MHz bandwidth. Supporting Wi-Fi Bluetooth hyper-connection technology, the smartphone can simultaneously connect to Bluetooth headsets, wireless handles and other peripherals with lower latency.
• Supporting the Dimensity open architecture can bring a more personalized and differentiated user experience to terminal devices and release more potential of the chip.

It is expected that the first batch of smartphone brands using Dimensity 8300 mobile chips will include Xiaomi, OPPO and vivo

At the event, Xiaomi Group President Lu Weibing announced that Xiaomi plans to cooperate with MediaTek Launched the jointly customized exclusive chip Dimensity 8300 Ultra, which will be launched on the Redmi K70E on November 29. At the same time, ThePaper OS will also be launched on the Dimensity platform for the first time on this phone.

Lu Weibing said that Xiaomi K70E is expected to be the only mobile phone of its class that can experience complete generative AI capabilities.

At the same time, OPPO also announced at the press conference that the Reno 11 series to be released the day after tomorrow will also be equipped with Dimensity 8300.

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