Sprinting on the 1nm process, Japan's Rapidus, the University of Tokyo and French research institutions collaborate to develop cutting-edge semiconductors

According to "Nihon Keizai Shimbun" report, Japanese chip manufacturer Rapidus and the University of Tokyo will cooperate with French semiconductor research institute Leti to jointly develop basic technologies for next-generation semiconductor design with circuit line widths of 1 nanometer level

The report stated that the two parties will start personnel exchanges and technology sharing starting next year. The French research institution Leti will contribute its expertise in chip components to build an infrastructure for supplying 1nm products.

The goal of both parties is to establish the basic technology required to design and develop semiconductors with line widths of 1.4nm-1nm. Manufacturing 1nm products requires a different transistor structure than traditional ones, and Leti has strong capabilities in key technologies such as film formation in this field.

Compared with 2nm, 1nm technology can improve computing performance and efficiency by 10-20%. Rapidus has partnered with IBM and Belgian R&D group Imec to achieve its goal of mass production of 2nm chips by 2027, with 1nm semiconductors expected to enter the mainstream as soon as the 2030s. At the same time, IBM is also considering cooperation with Rapidus in the 1nm field.

According to previous reports on this site, ASML, a large Dutch semiconductor manufacturing equipment manufacturer, will build a new technical support base in Hokkaido, Japan, by the second half of 2024. Rapidus is striving to mass-produce the most advanced semiconductors. ASML will provide Rapidus with assistance in factory construction and maintenance inspections, and increase domestic personnel in Japan by 40% by around 2028.

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