News that Samsung is considering using 3D Chiplet technology in Exynos SoC

According to ZDNet, Samsung is actively considering applying 3D chiplet technology to future Exynos series SoCs

Informed sources explained that "Samsung Electronics is internally considering applying 3D Chiplet to Exynos." "We believe there are significant benefits to be gained by doing so," he added. He noted that 3D Chiplets will help Exynos increase its production efficiency, thereby enhancing its competitiveness.

Chiplet is mainly a type of die (bare chip) that meets specific functions and implements multiple modules through die-to-die internal interconnection technology The chip is packaged with the underlying basic chip to form a system chip to achieve a new form of IP reuse, which is very different from the mainstream SoC design concept.

Currently, mainstream SoC system-level single-chips mainly fabricate multiple computing units responsible for different types of computing tasks onto the same wafer through photolithography. For example, the AP chip of a mobile phone will integrate different units such as CPU, GPU, DSP, ISP, NPU, Modem, etc., as well as numerous interface IP

Relatively speaking, Chiplet is an original complex SoC chip. When designing, we first decompose it according to different computing units or functional units, and then select the most suitable semiconductor process technology for each unit to be manufactured separately. Then, each unit is interconnected with each other through advanced packaging technology, and finally integrated and packaged into a system-level Chipset

As the chip manufacturing process evolves to single-digit nanometers (nm), the difficulty of the process and the complexity of the internal structure continue to increase, the manufacturing process becomes more complex, and the design cost of the entire chip process increases significantly. This is why Chiplet is affected by A big reason for concern. As the chip manufacturing process advances to the nanometer level, the difficulty of the process and the complexity of the internal structure continue to increase, the manufacturing process also becomes more complex, and the full-process design cost of the chip increases significantly. This is also an important reason why Chiplet has received widespread attention

In the context of the slowdown of "Moore's Law" in recent years, Chiplets have become a technology that the industry has high hopes for, and may continue the "economic benefits" of Moore's Law from another angle

At the moment, NVIDIA, Well-known companies such as AMD and Intel are introducing chip components into the development of semiconductors for high-performance computing (HPC) systems. We have noticed that Canadian AI semiconductor startup TenStorent also recently announced that it will use Samsung foundries to produce 4nm chips

Foreign media also pointed out that mobile application processing Devices are an area that requires the most advanced foundry technology and are very sensitive to yield. Therefore, more stable production can be achieved by using 3D chipsets

In addition, through 3D packaging technology, we can further reduce the overall package size of the chip and improve the connectivity between chips. Bandwidth and efficiency

According to data from market research company Counterpoint Research, the mobile AP market share in the second quarter of this year was calculated by sales, and Qualcomm accounted for 40%. %, Apple accounts for 33%, MediaTek accounts for 16%, and Samsung Electronics accounts for only 7%

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