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Ming-Chi Kuo: Apple iPhone 16 series introduces stacked rear camera sensor design

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2023-08-05 22:13:041168browse

According to Apple industry analyst Ming-Chi Kuo, the iPhone 16 series will adopt a stacked rear camera sensor design, covering the entire product line

郭明錤:苹果 iPhone 16 系列引入堆叠式后置摄像头传感器设计

This year The iPhone 15 and iPhone 15 Plus will use a stacked CMOS image sensor (CIS) design, and the rear camera will reach 48 million pixels to provide more powerful light capture capabilities

Output of new sensor design The problem may prevent Apple from applying it to all iPhone 15 models this year. Although Sony's high-end CIS production capacity is expected to be tight until 2024, Apple has already won most of Sony's orders. Ming-Chi Kuo expects high-end CIS (48MP) shipments to increase by 50% in the second half of this year to 36 million pieces. Among them, the shipments in the third quarter and fourth quarter were 16 million and 20 million pieces respectively.

This site learned from Ming-Chi Kuo’s revelations that Sony’s tight production capacity will benefit its rival supplier Will Semi (Will), thereby obtaining more high-end CIS orders from Chinese smartphone brands. Among Vail's high-end CIS,

's main contributions come from OV50A, OV50E, OV50H and OV64B, which replaced many Sony orders.

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