Sources say Samsung is accelerating the production of HBM memory chips for AI to compete with Hynix

IT Home News on June 27, in May this year, Kye Hyun Kyung, president of Samsung’s equipment solutions division, admitted that Samsung’s foundry technology lagged behind TSMC. He also said that Samsung will surpass TSMC within five years. According to the latest news, Samsung plans to mass-produce high-speed memory chips designed for artificial intelligence applications this year.

According to foreign media KoreaTimes, Samsung plans to mass-produce HBM chips for AI in the second half of 2023. At present, their main goal is to catch up with SK Hynix, which has quickly taken the lead in the AI ​​memory chip market. status.

IT House noted that SK Hynix will hold about 50% of the HBM market in 2022, while Samsung will hold about 40%. Micron holds the remaining 10%. However, the HBM market is relatively small, accounting for only about 1% of the entire DRAM market.

Nonetheless, as the AI ​​market grows, the demand for HBM solutions is expected to increase. Samsung now plans to catch up with SK Hynix and mass-produce HBM3 chips to cope with market changes. Memory chips applying AI are becoming more and more popular. development is widespread, and high-bandwidth storage solutions are gaining more and more attention.

Previous news said that Samsung has won AMD and Google as its customers. Samsung will manufacture Google’s Tensor 3 chip on its third-generation 4-nanometer process node. The rumored Exynos 2400 SoC may also be on the 4-nanometer process. Made on.

▲ Google’s Tensor 3 chip rendering, source XDA

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