It is reported that the Xiaomi Mi 15 Pro engineering machine adopts a new module with a round and square design, and a 50Mp ultra-large bottom main camera

IT Home News on May 13, blogger @digitalchatstation today brought the latest news about Xiaomi’s “Big Cup” engineering machine, which is expected to come from Xiaomi 15 Pro.

1. According to the blogger, this engineering machine is equipped with a square Deco in the upper left corner. The flash is moved outside the Deco. The current image shows a 50Mp ultra-large bottom main camera + 50Mp ultra-wide-angle + 50Mp periscope telephoto, new module with round and square design, not JN1 sensor.

2. According to the current very early prototype feedback, this new phone will also be equipped with a 2K new substrate full depth micro-curved screen, and the screen size will not change much. In addition, the machine is equipped with a 50MP ultra-large bottom three-camera solution, one of which is a periscope telephoto with telephoto macro and a full-range ultra-large aperture solution.

   

   ▲ IT Home Photo Appreciation: Xiaomi 14 Pro 14 Pro is equipped with Snapdragon 8 Gen 3 processor

equipped with a 6.73-inch 2K AMOLED full depth slightly curved screen

with a peak brightness of up to 3000nit

1. Built-in 4880mAh battery
2. Supports 120W Xiaomi Pengpai wired second charging
3. Supports 50W Xiaomi Pengpai wireless second charging
4. Supports wireless reverse charging#🎜🎜 #
5. Imaging:
6. Equipped with 50 million Leica super dynamic main camera (Light and Shadow Hunter 900 custom image sensor)
7. Equipped with Leica 75mm floating telephoto

Equipped with 50MP Leica ultra-wide angle

Front-facing 32MP high-definition camera
2. According to the information disclosed by Qualcomm, The 2024 Snapdragon Summit will be held in October, when the company will launch its flagship Snapdragon 8 Gen 4 SoC. As for when the new Xiaomi 15 series will be launched, IT House will also keep an eye on it.

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