SK Hynix: Seven major U.S. technology giants have expressed their intention to customize HBM memory

News from this site on August 20, according to Korean media MK, Ryu Seong-soo, SK Hynix’s vice president in charge of HBM memory business, said at the SK Group’s 2024 Icheon Forum yesterday local time that M7 technology giants have expressed their hope that SK Hynix intends to develop customized HBM products for it.

Note from this site: M7 stands for Magnificent 7, which refers to the seven major technology giants in the US stock market: Apple, Microsoft, Alphabet (Google), Tesla, Nvidia, Amazon and Meta.

Ryu Seong-soo mentioned that he continued to work on weekends, communicating on the phone with M7 companies, and running around to meet the needs of these companies to integrate engineering resources within SK hynix and supply chain companies across Korea.

The executive believes that as the demand for customized products increases and the storage industry is about to reach a critical point of paradigm shift, SK Hynix will continue to take advantage of the opportunities brought by these changes to develop its memory business.

Ryu Seong-soo also said that with the segmentation of the AI ​​market, SK hynix will not only continue to provide solutions for the mass market in the future, but also launch differentiated products with performance that can be 20~30 times that of existing models.

Referring to previous reports, SK is expected to launch 12-layer stacked HBM4 memory products using MR-MUF bonding technology in the second half of 2025, while higher-capacity 16-layer stacked HBM is expected to be launched in 2026 when relevant demand arises release.

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