Home >Mobile Tutorial >Mobile News >realme 13+ mobile phone appears on benchmarking platform, expected to be equipped with Dimensity 7300 series processor
Thanks to netizen South China Wu Yanzu for submitting the clue! According to news on August 9, a new realme phone with model number RMX5000 appeared on the GeekBench benchmark testing platform on July 31. It is expected to be the upcoming Realme 13+ mobile phone.
Dimensity 7300 and Dimensity 7300X are both built on TSMC’s 4nm process. The CPU part is an eight-core architecture composed of 4 Cortex-A78 clocked at 2.5GHz and 4 Cortex-A55, equipped with Arm Mali-G615 MC2 GPU, supporting LPDDR4x, LPDDR5 memory + UFS 3.1 flash memory.
In addition, the two processors support Wi-Fi 6E, Bluetooth 5.4, support 5G dual-card technology, and support dual-card VoNR; integrated AI processor APU 655, AI performance is 2 times that of Dimensity 7050.
For more configuration information about realme 13+ mobile phone, interested friends can pay attention to follow-up reports.
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