Samsung Electronics announces mass production of the industry’s thinnest LPDDR5X memory package, approximately 9% thinner than the previous generation

According to news from this website on August 6, Samsung Electronics today announced the launch of mass production of the industry’s thinnest LPDDR5X memory package. The package height of this new product is 0.65mm, which is about 9% lower than the 0.71mm of the previous generation product, and its heat resistance is improved by 21.2%.

The LPDDR5X memory package launched by Samsung Electronics this time is based on 12nm-class LPDDR DRAM. It adopts a 4-stack, 2-layer structure design per stack, and is available in two capacity versions: 12GB and 16GB.

In the process of manufacturing this memory package, Samsung Electronics optimized PCB and epoxy molding compound (Note on this site: Epoxy Molding Compound, referred to as EMC) technology, and combined it with the wafer back grinding process to make it Becoming the thinnest LPDDR DRAM module with capacity of 12GB and above.

The lower package height and better heat resistance can provide more ventilation space for mobile devices, thereby improving the overall heat dissipation effect of the device, and ultimately achieving better performance in high-load device-side generative AI applications. Performance.

Bae YongCheol, executive vice president of memory product planning at Samsung Electronics, said:

Samsung’s LPDDR5X DRAM sets a new standard for high-performance device-side AI solutions, not only providing excellent LPDDR performance, but also in an ultra-compact package Advanced thermal management is implemented in it.

We are committed to continuous innovation through close cooperation with customers to provide solutions that meet the future needs of the LP DRAM market.

Samsung Electronics plans to expand the ultra-thin LPDDR DRAM memory package to 6-stack 24GB and 8-stack 32GB modules in the future.

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