Sony's CIS production capacity is tight, and it is reported that Apple's iPhone 16 series is testing Samsung CMOS as a second supplier

July 3 news, TheElec reported that although Apple had previously relied entirely on Sony for CIS (CMOS image sensors), due to production capacity reasons, Apple is already preparing to introduce Samsung Electronics as a second supplier, and is currently working on Samsung System The LSI department's CIS conducts final quality testing (will be used for the main camera of the next generation iPhone). Looking back on previous models, the iPhone usually uses Sony's CIS, but starting last year, there were some problems with the cooperation between the two parties. Sources mentioned that because Sony failed to supply CIS in time at the end of last year, it was difficult for Apple to determine the release date of the iPhone 15. Therefore, Apple applied to Samsung Electronics last year to conduct research and development of such CIS in order to diversify the supply chain.

He pointed out that if Samsung passes the quality test (which he thinks is very likely), this will represent the first time that Samsung will supply CIS for iPhone, and will also break Sony’s monopoly in the field of iPhone CIS.

▲ Sony CIS industry insiders said: "This project is entirely to meet Apple's needs, so if Samsung can pass the test, supply will no longer be a problem", "Sony will still be the largest supplier suppliers, but Samsung is expected to expand its share. ”

▲ Samsung CIS

TheElec also mentioned that the new CIS on Apple iPhone 16 will use Samsung’s three-layer wafer stacking technology to stack three different wafers together. Which respectively include -

1. Photodiodes
2. Transistors
3. The logic part of the analog-to-digital converter

Double-layer stacking technology has been used before (Sony's marketing name is "Double-layer transistor pixel stacked CMOS image sensor" technology"), i.e. photodiode and transistor layers. fenyeThree-layer wafer stacking technology

Three-layer wafer stacking design realizes electrical interconnection between wafer layers. Compared with double-layer stacking, three-dimensional integration technology improves transmission speed, reduces latency, enhances performance, and reduces power consumption.

Wafer Applications in CIS

CIS involves the use of photodiodes and transistors together. Photodiodes convert light signals into electrical signals, and transistors are responsible for transmitting, amplifying, reading, and erasing electrical signals.

Apple’s stacking method

Apple separates the wafers, processes them individually, and connects the three logic wafers using hybrid stacking. This method reduces noise and increases pixel density.

Copper Pad Connection

This stacking technology connects directly through copper pads without signal transmission bumps. This makes the CIS smaller and faster.

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