Up to 6400CL34, Kefu launches FIT V DDR5 gaming overclocking memory module

According to news from this website on June 27, Kefu today launched FIT V DDR5 gaming overclocking memory. Kefu claims that this RGB-less memory module "combines high cost performance and excellent stability" and is a "burdenless upgrade" option to DDR5.

FIT V DDR5 adopts a 33.2mm low-profile heat sink design and has good hardware compatibility. The memory module is equipped with stylish and simple white aluminum heat dissipation vests on both sides, which improves the heat dissipation performance under high load.

The first batch of Kefu FIT V DDR5 memory modules have a single capacity of 16GB, including both 16GB×1 single module and 16GB×2 set module.

FIT V DDR5 memory module supports Intel XMP 3.0 and AMD EXPO memory overclocking technology, and has passed the QVL test of the four major board manufacturers.

This memory includes three specifications: 5600CL30, 6000CL32, and 6400CL34. The specific parameters of this website are as follows:

Kefu FIT V DDR5 memory module
Speed	5600MT/s	6000MT/ s	6400MT/s
Delay timing	30-36-36-88	32-38-38-78	34-40-40-90
Voltage	1.25V	1.35V	1.35V

Kefu said that FIT V DDR5 gaming memory modules are planned to be launched in July 2024.

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