TSMC will build seven new factories in 2024, but tripling its 3nm production capacity year-on-year is still insufficient

According to news from this site on May 24, TSMC executive Huang Yuanguo said at the 2024 TSMC Technology Forum Hsinchu Field yesterday that the company will build seven new factories this year, and this year’s 3nm production capacity will be four times that of last year.

Specifically, TSMC will build 5 wafer fabs and 2 advanced packaging plants around the world in 2024.

TSMC’s Fab 20 in Hsinchu and F22 wafer fab in Kaohsiung are both oriented to the 2nm process and are currently in the equipment entry stage. It is expected to resume mass production in 2025.

Earlier reports on this site also mentioned that TSMC has confirmed that its European subsidiary ESMC’s first wafer fab in Dresden, Germany will start construction in the fourth quarter of this year and is expected to be put into production in 2027.

TSMC will also build two advanced packaging factories in Taichung and Chiayi respectively. The former is expected to achieve mass production of CoWoS in 2025, and the latter will mass produce CoWoS and SoIC technologies in 2026.

Huang Yuanguo revealed that TSMC’s 3nm production capacity this year will increase significantly by 300% compared with last year, but is still not enough to meet all the needs of users.

TSMC’s advanced process production capacity will have a compound annual growth rate of about 25% from 2020 to 2024.

The above is the detailed content of TSMC will build seven new factories in 2024, but tripling its 3nm production capacity year-on-year is still insufficient. For more information, please follow other related articles on the PHP Chinese website!